ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
The purpose of the present invention is to provide an electrostatic discharge (ESD) protection device having high holding voltages. The ESD protection device comprises: a semiconductor substrate; a first well; a second well; a first foreign matter region; a second foreign matter region; a third fore...
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Zusammenfassung: | The purpose of the present invention is to provide an electrostatic discharge (ESD) protection device having high holding voltages. The ESD protection device comprises: a semiconductor substrate; a first well; a second well; a first foreign matter region; a second foreign matter region; a third foreign matter region; and a fourth foreign matter region. The first well is formed on the semiconductor substrate and has a first conductive type. The second well is formed on the semiconductor substrate to come in contact with the first well, and has a second conductive type. The first foreign matter region is formed on the first well and has the first conductive type. The second foreign matter region is formed on the first well to be separated from the first foreign matter region, from the first foreign matter region toward the second well, and has a second conductive type. The third foreign matter region is formed on the second well, and has the second conductive type. The fourth foreign matter region is formed on the second well to come in contact with the third foreign matter region, from the third foreign matter region toward the first well, and has the first conductive type. The first foreign matter region and the second foreign matter region are electrically connected to a first electrode pad. The third foreign matter region is electrically connected to a second electrode pad. The fourth foreign matter region is electrically floated.
ESD 보호 장치는 반도체 기판, 제1 웰, 제2 웰, 제1 불순물 영역, 제2 불순물 영역, 제3 불순물 영역, 및 제4 불순물 영역을 포함한다. 제1 웰은 반도체 기판에 형성되고, 제1 도전형을 갖는다. 제2 웰은 반도체 기판에 제1 웰과 접하도록 형성되고, 제2 도전형을 갖는다. 제1 불순물 영역은 제1 웰에 형성되고, 제1 도전형을 갖는다. 제2 불순물 영역은 제1 웰에 제1 불순물 영역으로부터 제2 웰 방향으로 제1 불순물 영역과 이격되어 형성되고, 제2 도전형을 갖는다. 제3 불순물 영역은 제2 웰에 형성되고, 제2 도전형을 갖는다. 제4 불순물 영역은 제2 웰에 제3 불순물 영역으로부터 제1 웰 방향으로 제3 불순물 영역과 접하도록 형성되고, 제1 도전형을 갖는다. 제1 불순물 영역 및 제2 불순물 영역은 제1 전극 패드와 전기적으로 연결되고, 제3 불순물 영역은 제2 전극 패드와 전기적으로 연결되고, 제4 불순물 영역은 전기적으로 플로팅된다. |
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