PACKAGE ON PACKAGE AND MOBILE COMPUTING DEVICE HAVING THE SAME
A package-on-package is disclosed. The package-on-package comprises: a first PCB; a lower package which includes a first chip die and a second chip die attached to the first PCB; an upper package which includes a second PCB and a third chip die attached to the second PCB, and is overlaid on the lowe...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | A package-on-package is disclosed. The package-on-package comprises: a first PCB; a lower package which includes a first chip die and a second chip die attached to the first PCB; an upper package which includes a second PCB and a third chip die attached to the second PCB, and is overlaid on the lower package; and first stack connection solder balls and second stack connection solder balls which are electrically connected between the first PCB and the second PCB, and are formed only around two sides facing each other among sides of the lower package. Therefore, the size and the height of the package-on-package can be reduced.
패키지 온 패키지가 개시된다. 상기 패키지 온 패키지는 제1PCB와, 제1PCB에 부착된 제1칩 다이와 제2칩 다이를 포함하는 하부 패키지와, 제2PCB와 상기 제2PCB에 부착된 제3칩 다이를 포함하고, 상기 하부 패키지의 위에 가로놓인 상부 패키지와, 상기 제1PCB와 상기 제2PCB 사이에 전기적으로 접속되고, 상기 하부 패키지의 변들 중에서 서로 마주보는 두 개의 변들 주위에만 형성된 제1스택 연결 솔더 볼들과 제2스택 연결 솔더 볼들을 포함한다. |
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