RESIN COMPOSITION OF HOTMELT ADHESIVE

Disclosed is a resin composition for a hot-melt adhesive which has maximized thermostability. While maintaining general properties such as adhesive properties, transparency, etc., the resin composition of the present invention prevents discoloration or degradation of physical properties caused by al...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, JIN WOO, YOON, SUNG TAEK, SEO, JUNG MIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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