RESIN COMPOSITION OF HOTMELT ADHESIVE
Disclosed is a resin composition for a hot-melt adhesive which has maximized thermostability. While maintaining general properties such as adhesive properties, transparency, etc., the resin composition of the present invention prevents discoloration or degradation of physical properties caused by al...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | Disclosed is a resin composition for a hot-melt adhesive which has maximized thermostability. While maintaining general properties such as adhesive properties, transparency, etc., the resin composition of the present invention prevents discoloration or degradation of physical properties caused by alteration of the resin which may be generated when a conventional ethylene-vinyl acetate copolymer resin composition for purposes as a hot-melt adhesive is formed into a complete product in a high-temperature manufacturing process, or using an complete adhesive product at high temperature. The resin composition for a hot-melt adhesive comprises: 100 parts by weight of an ethylene-vinyl acetate copolymer; 0.01 to 0.25 parts by weight of a phenol-based antioxidant; 0.01 to 0.15 parts by weight of a phosphorus-based antioxidant; and 0.01 to 0.15 parts by weight of a sulfur-based antioxidant.
종래 핫멜트 접착제 용도의 에틸렌-비닐아세테이트 공중합체 수지 조성물이 고온의 제조 공정에서 완제품으로 성형될 경우, 또는 고온에서 접착제 완제품을 사용할 경우 발생할 수 있는 변색 현상이나 수지 변질에 의한 물성 저하를 방지하여, 접착성, 투명성 등 제반 물성이 우수하면서도, 내열안정성이 극대화된 핫멜트 접착제용 수지 조성물이 개시된다. 본 발명은 에틸렌-비닐아세테이트 공중합체 100중량부; 페놀계 산화방지제 0.01~0.25중량부; 인계 산화방지제 0.01~0.15중량부; 및 황계 산화방지제 0.01~0.15중량부;를 포함하는 핫멜트 접착제용 수지 조성물을 제공한다. |
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