BONDING APPARATUS AND SUBSTRATE MANUFACTURING EQUIPMENT INCLUDING THE SAME

The present invention discloses a bonding apparatus and substrate manufacturing equipment including the same. The bonding apparatus includes: an upper stage; a lower stage disposed to face the upper stage and providing a process substrate with semiconductor chips mounted on a substrate; and a push m...

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Bibliographische Detailangaben
Hauptverfasser:	HAN, IL YOUNG, OH, GEUN SIK, SHIM, DONG GIL, LEE, SUK WON, LEE, JUN HO, KIM, KYOUNG RAN, LEE, YOUNG JOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention discloses a bonding apparatus and substrate manufacturing equipment including the same. The bonding apparatus includes: an upper stage; a lower stage disposed to face the upper stage and providing a process substrate with semiconductor chips mounted on a substrate; and a push member moving the lower stage to the upper stage to pressurize the substrate. According to the present invention, the semiconductor chips can be more accurately bonded. 본 발명은 본딩 장치 및 그를 포함하는 기판 제조 설비를 개시한다. 그의 장치는, 상부 스테이지와, 상기 상부 스테이지에 마주하여 배치되고, 기판 상에 반도체 칩들이 마운트된 처리 기판이 제공되는 하부 스테이지와, 상기 상부 스테이지에 상기 하부 스테이지를 이동시켜 상기 기판을 가압하는 가압력을 제공하는 누름 부재를 포함한다.