SEMICONDUCTOR PACKAGE
According to a technical concept of the present invention, a semiconductor package comprises: a semiconductor chip having an active surface and a non-active surface; a ground member existing on the active surface of the semiconductor chip; and an electromagnetic shielding member passing through the...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | According to a technical concept of the present invention, a semiconductor package comprises: a semiconductor chip having an active surface and a non-active surface; a ground member existing on the active surface of the semiconductor chip; and an electromagnetic shielding member passing through the semiconductor chip to be electrically connected to the ground member, and covering at least a portion of the non-active surface of the semiconductor chip. Therefore, the semiconductor package has an electromagnetic shielding structure with superior electromagnetic inference characteristics.
본 발명의 기술적 사상에 의한 반도체 패키지는, 활성면 및 비활성면을 갖는 반도체 칩, 반도체 칩의 활성면에 존재하는 접지 부재 및 반도체 칩을 관통하여 접지 부재와 전기적으로 연결되며 반도체 칩의 비활성면의 적어도 일부를 덮는 전자파 차폐 부재를 포함하는 것을 특징으로 한다. |
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