A LIGHT EMITTING DEVICE PACKAGE AND A LIGHT EMITTING MODULE INCLUDING THE SAME

According to an embodiment of the present invention, a light emitting device package comprises: a package body; a lead frame arranged on the package body; a light emitting device arranged on the lead frame; an adhesion member arranged between the light emitting device and the lead frame; and a resin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KWON, JI NA
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	According to an embodiment of the present invention, a light emitting device package comprises: a package body; a lead frame arranged on the package body; a light emitting device arranged on the lead frame; an adhesion member arranged between the light emitting device and the lead frame; and a resin layer surrounding the light emitting device. The package body includes a resin and a volatile rust inhibitor, wherein the volatile rust inhibitor is in a form mixed with the resin. 실시 예에 따른 발광 소자 패키지는 패키지 몸체, 상기 패키지 몸체 상에 배치되는 리드 프레임, 상기 리드 프레임 상에 배치되는 발광 소자, 상기 발광 소자와 상기 리드 프레임 사이에 배치되는 접착 부재, 및 상기 발광 소자를 포위하는 수지층을 포함하며, 상기 패키지 몸체는 수지 및 기화성 방청제를 포함하며, 상기 기화성 방청제는 상기 수지와 혼합된 형태이다.