PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

According to the present invention, provided is a printed circuit board, comprising: an insulating member; a first plating layer embedded in a lower area of the insulation member; a second plating layer embedded in an upper area of the insulation layer; and a plating via coupling the first plating l...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, SEUNG EUN, KWON, KWANG HEE, CHUNG, YUL KYO, SUNG, KI JUNG, IM, SE RANG, HWANG, JUN OH, LEE, YOUNG KWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	According to the present invention, provided is a printed circuit board, comprising: an insulating member; a first plating layer embedded in a lower area of the insulation member; a second plating layer embedded in an upper area of the insulation layer; and a plating via coupling the first plating layer and the second plating layer arranged in a diagonal direction. Accordingly, high reliability may be secured on a flexible substrate, which requires flexibility. 본 발명은, 절연 부재와, 상기 절연 부재의 하부 영역에 매립된 제1 도금층, 상기 절연 부재의 상부 영역에 매립된 제2 도금층 및 상기 절연 부재에 매립되며, 사선 방향으로 배치된 상기 제1 도금층과 상기 제2 도금층을 연결하는 도금비아를 포함하는 인쇄회로기판을 제시한다.