PACKAGE ON PACKAGE(POP) AND COMPUTING DEVICE HAVING THE POP

PACKAGE ON PACKAGE(POP) AND COMPUTING DEVICE HAVING THE POP

A semiconductor package comprises: a printed circuit board (PCB); a chip attached to the PCB; a mold protecting the chip and exposing a bottom surface of the chip; vias formed on the mold to expose first contact balls attached to the PCB; and at least one first mark carved in a marking region of the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHO, BYEONG YEON, LEE, HAE GU, KWON, HEUNG KYU
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package comprises: a printed circuit board (PCB); a chip attached to the PCB; a mold protecting the chip and exposing a bottom surface of the chip; vias formed on the mold to expose first contact balls attached to the PCB; and at least one first mark carved in a marking region of the mold between the bottom surface of the chip and the vias. The mold has an exposed molded underfill (eMUF) structure. The purpose of the present invention is to provide a package on package (PoP) capable of improving visibility of a mark. 반도체 패키지는 PCB와, 상기 PCB에 부착된 칩과, 상기 칩을 보호하고 상기 칩의 바닥 표면을 노출하는 몰드와, 상기 PCB에 부착된 제1접촉 볼들을 노출하기 위해 상기 몰드에 형성된 비아들과, 상기 몰드 중에서 상기 칩의 상기 바닥 표면과 상기 비아들 사이의 표시 영역에 새겨진 적어도 하나의 제1표시를 포함한다. 상기 몰드는 상기 칩의 상기 바닥 표면을 노출하는 eMUF(exposed molded underfill) 구조를 갖는다.