DEVICE FOR ATTACHING OBJECT AND METHOD OF ATTACHING OBJECT USING THEREOF

Disclosed are a device for attaching an object and a method of attaching an object using the same. The device for attaching an object according to an embodiment of the present invention includes an object supply unit which supplies an object to be attached to a substrate; and an attaching unit which...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG, CHANG YONG, KOO, BYUNG WAN, BHANG, SHIN HAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Disclosed are a device for attaching an object and a method of attaching an object using the same. The device for attaching an object according to an embodiment of the present invention includes an object supply unit which supplies an object to be attached to a substrate; and an attaching unit which is adjacent to the object supply unit, and attaches the object to the substrate while being attached with the object. The attaching unit includes an attaching unit body; and an attaching part which is prepared in the attaching unit body, and has an attaching belt attached to one side of the object. 대상물 부착장치 및 이를 이용한 대상물 부착방법이 개시된다. 본 발명의 일 실시예에 따른 대상물 부착장치는, 기판에 부착되는 대상물을 공급하는 대상물 공급유닛; 및 대상물 공급유닛에 인접하게 마련되며, 대상물을 점착한 상태에서 기판에 대상물을 부착하는 부착유닛을 포함하며, 부착유닛은, 부착유닛 본체; 및 부착유닛 본체에 마련되며, 대상물이 일면에 점착되는 점착벨트를 구비한 점착부를 포함한다.