APPARATUS AND METHOD FOR ALIGNING WAFER

An embodiment relates to an apparatus for aligning a wafer, comprising: a rotational body which rotates a wafer; a wafer placing unit which has an extended arm and places the wafer; a notch recognition unit which is arranged to face an outline of the wafer placed on the wafer placing unit to recogni...

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Bibliographische Detailangaben
Hauptverfasser: JANG, JUN YOUNG, KANG, CHI HUN
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:An embodiment relates to an apparatus for aligning a wafer, comprising: a rotational body which rotates a wafer; a wafer placing unit which has an extended arm and places the wafer; a notch recognition unit which is arranged to face an outline of the wafer placed on the wafer placing unit to recognize a notch; and a mark recognition unit which is spaced apart from the notch recognition unit and is arranged to face the outline of the wafer to recognize a mark of the wafer. 실시예는 웨이퍼 정렬 장치에 관한 것으로서, 실시예는 웨이퍼를 회전시키는 회전체와, 회전체로부터 연장된 암을 갖고, 웨이퍼를 안착시키는 웨이퍼 안착부와, 웨이퍼 안착부에 안착된 웨이퍼의 외곽을 바라보며 배치되어 노치를 인식하는 노치 인식부와, 노치 인식부와 이격되고, 웨이퍼의 외곽을 바라보며 배치되어 웨이퍼의 마크를 인식하는 마크 인식부를 포함한다.