PRINTED CIRCUIT BOARD

The present invention relates to a printed circuit board. The printed circuit board comprises an insulating substrate; a first circuit pattern formed on one surface of the insulating substrate; a second circuit pattern which is formed on the other surface of the insulating substrate; and an element...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SEONG, DAE HYEON, LEE, KYU WON, KOO, KYO HUN, MYEONG, SE HO, YEO, KI SU, HAN, JOON WOOK
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention relates to a printed circuit board. The printed circuit board comprises an insulating substrate; a first circuit pattern formed on one surface of the insulating substrate; a second circuit pattern which is formed on the other surface of the insulating substrate; and an element which is arranged from the inside of the insulating layer to one side of the insulating substrate. 본 발명은 인쇄회로기판에 관한 것으로, 절연 기판; 상기 절연 기판의 일면에 형성되는 제1 회로 패턴; 상기 절연 기판의 타면에 형성되는 제2 회로 패턴; 및 상기 절연 기판 내에서 상기 절연 기판의 일면 측에 배치되는 소자;를 포함하여 구성된다.