PROCESS FOR PRODUCING TRANSFERABLE FILM WITH BURIED CONDUCTIVE WIRING AND THE FILM WITH BURIED CONDUCTIVE WIRING THEREBY
The present invention relates to a method for manufacturing a transferable film with a buried conductive wire and the film with a buried conductive wire thereby. A release operation is easily processed in a transfer process by the surface treatment of a substrate. After that, post heat treatment is...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | The present invention relates to a method for manufacturing a transferable film with a buried conductive wire and the film with a buried conductive wire thereby. A release operation is easily processed in a transfer process by the surface treatment of a substrate. After that, post heat treatment is performed under an inactive atmosphere. So, a surface treatment effect can be maintained. Also, heat treatment is performed at a temperature higher than the decomposition temperature of nano-ink under an inactive atmosphere. Thereby, the tissue of nanoparticles is densified. Finally, an electrode with high electric conductivity can be secured.
본 발명은 전사 가능한 전도성 배선이 함입된 필름의 제조방법 및 이에 따라 제조된 전도성 배선이 함입된 필름에 관한 것으로, 기판의 표면 처리를 통해 전사 공정에서 이형이 용이하게 처리를 한 후, 후속 열처리를 비활성 분위기에서 시행함으로써 표면 처리 효과를 유지시킬 수 있다. 또한, 비활성 분위기에서 나노 잉크 분해 온도 이상의 높은 온도에서 열처리를 함으로써 나노입자 조직을 치밀화시켜 최종적으로 전극의 높은 전기 전도도를 확보하는 효과가 있다. |
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