PACKAGE BOARD AND PACKAGE USING THE SAME

The present invention relates to a package board and a package using the same. According to an embodiment of the present invention, the package board comprises: an insulating layer; circuit patterns formed in the insulating layer; a capacitor formed on a whole surface of a horizontal plane in the in...

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Bibliographische Detailangaben
Hauptverfasser:	KANG, MYUNG SAM, LEE, SEUNG EUN, KOOK, SEUNG YEOP, IM, SE RANG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a package board and a package using the same. According to an embodiment of the present invention, the package board comprises: an insulating layer; circuit patterns formed in the insulating layer; a capacitor formed on a whole surface of a horizontal plane in the insulating layer; and a first via penetrating the capacitor and electrically connecting the circuit patterns each formed on upper and lower portions of the capacitor to each other. 본 발명은 패키지 기판 및 이를 이용한 패키지에 관한 것이다. 본 발명의 실시 예에 따른 패키지 기판은 절연층, 절연층에 형성된 회로 패턴, 절연층 내부의 수평면의 전면에 형성된 캐패시터 및 캐패시터를 관통하여 캐패시터의 상부와 하부에 각각 형성된 회로 패턴을 서로 전기적으로 연결하는 제1 비아를 포함한다.