INTEGRATED COMPACT IMPINGEMENT ON EXTENDED HEAT SURFACE

A thermal management system which provides cooling to an electronic device is disclosed. The thermal management system comprises: a surface having a plurality of extended elements thermally coupled to the surface; a plurality of vibrator assemblies configured to generate a cooling flow over the surf...

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Bibliographische Detailangaben
Hauptverfasser:	GIOVANNIELLO CHRISTIAN M, UTTURKAR YOGEN VISHWAS, WHALEN BRYAN PATRICK, REFAI AHMED GAMAL, FERGUSON MATTHEW A, DE BOCK HENDRIK PIETER JACOBUS
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A thermal management system which provides cooling to an electronic device is disclosed. The thermal management system comprises: a surface having a plurality of extended elements thermally coupled to the surface; a plurality of vibrator assemblies configured to generate a cooling flow over the surface; and a mounting structure disposed in an upper portion of the extended elements of the surface to position the plurality of vibrator assemblies with respect to the surface. The mounting structure is configured to orient each of the plurality of vibrator assemblies to the surface at an angle, such that the cooling flow generated by the plurality of vibrator assemblies impinges on the extended elements at an angle. 전자 장치에 냉각을 제공하는 열 관리 시스템이 개시된다. 열 관리 시스템은, 표면에 열적으로 결합된 복수의 연장형 요소를 갖는 표면, 표면에 걸쳐 냉각 흐름을 생성하도록 구성된 복수의 진동기 어셈블리, 및 표면에 대하여 복수의 진동기 어셈블리를 위치 설정하도록 표면의 복수의 연장형 요소의 상부에 배치된 장착 구조를 포함한다. 장착 구조는, 복수의 진동기 어셈블리에 의해 생성된 냉각 흐름이 연장형 요소에 비스듬히 충돌하도록, 복수의 진동기 어셈블리의 각각을 표면에 대하여 비스듬히 지향시키도록 구성된다.