COATING PROCESSING APPARATUS

The purpose of the present invention is to uniformly apply a coating solution to the inside of a substrate. In time T1 of initiating the application, a wafer and an application nozzle are relatively moved by a moving apparatus while the coating solution is discharged through a discharging hole when...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WAKAMOTO YUKIHIRO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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