TIN FILTERING METHODS, USING THIS METHOD FOR MANUFACTURING ALLOY AND SOLDER BALL

The present invention relates to a solder ball for a semiconductor package and, more specifically, relates to a method to filter tin in 2-7 micrometers and 3-4 bar; a method to manufacture an alloy on a high-frequency vacuum induction furnace; and a method to manufacture a solder ball using a manufa...

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Bibliographische Detailangaben
Hauptverfasser:	CHUN, MYOUNG HO, LEE, KUE YONG, LEE, HYUN KYU, KIM, KYEONG WON, KIM, SUN YOUNG, PARK, EUN KWANG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY PRETREATMENT OF RAW MATERIALS PRODUCTION AND REFINING OF METALS SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	The present invention relates to a solder ball for a semiconductor package and, more specifically, relates to a method to filter tin in 2-7 micrometers and 3-4 bar; a method to manufacture an alloy on a high-frequency vacuum induction furnace; and a method to manufacture a solder ball using a manufactured alloy. The present invention reduces a content of impurities in tin, and manufactures an alloy with low oxidation. 본 발명은 반도체 패키지용 솔더볼에 관한 것으로, 보다 상세하게는 주석을 2~7μm, 3~4bar에서 필터링 하는 방법 및 고주파 진공 유도로에서 합금을 제조하는 방법, 제조된 합금을 이용하여 솔더볼을 제조하는 방법에 관한 것이다.