APPARATUS AND METHOD OF COMPENSATING CHEMICAL MECHANICAL POLISHING PROCESS

The present invention relates to an apparatus for controlling compensation of a chemical mechanical polishing process and a method thereof. The apparatus includes: a parameter measurement part for measuring a parameter during the chemical mechanical polishing process; a display for displaying a meas...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOI, GWANG RAK, SEO, KANG KUK, CHO, MOON GI, CHOI, JAE YOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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