PHOTOSENSITIVE RESIN COMPOSITION

The present invention relates to a photosensitive resin composition, and more specifically, to a photosensitive resin composition providing a cured film increasing curability during exposure, and having excellent chemical resistance and resolution even in a low temperature process at a temperature e...

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Bibliographische Detailangaben
Hauptverfasser:	PARK, JIN KYU, LIM, CHOUL KYU, HONG, MYUNG SUN, CHA, HYUK JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present invention relates to a photosensitive resin composition, and more specifically, to a photosensitive resin composition providing a cured film increasing curability during exposure, and having excellent chemical resistance and resolution even in a low temperature process at a temperature equal to or lower than 150°C. The photosensitive resin composition includes a binder resin, a photopolymerization initiator, and an ethylene-based unsaturated compound. 본 발명은 감광성 수지 조성물에 관한 것으로, 보다 상세하게는 노광시 경화성을 높이고, 150℃ 이하의 저온 공정에서도 우수한 내화학성과 해상도를 갖는 경화막을 제공할 수 있는 감광성 수지 조성물에 관한 것이다.