CHIP ON BOARD TYPE LED MODULE

The present invention relates to an LED module. More particularly, the present invention relates to an LED module which can be manufactured in a small size by directly mounting an LED chip on a circuit board. In a chip on board type LED module according to the present invention, an LED package where...

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Bibliographische Detailangaben
Hauptverfasser:	HONG, SA CHEOL, JIN, JANG BUM, SHIN, JI SU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BLASTING HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS
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Beschreibung
Zusammenfassung:	The present invention relates to an LED module. More particularly, the present invention relates to an LED module which can be manufactured in a small size by directly mounting an LED chip on a circuit board. In a chip on board type LED module according to the present invention, an LED package where an LED chip is directly installed on a PCB, and a terminal for connecting a wire and the PCB are assembled in one mold. An LED penetration hole for penetrating the LED chip is formed in the mold. 본 발명은 엘이디 모듈에 관한 것으로, 더욱 상세하게는 엘이디 칩을 회로기판에 직접 탑재하여 소형으로 제작이 가능한 엘이디모듈에 관한 것이다. 본 발명에 따른 단일 몰드형 엘이디 모듈은, 엘이디 칩이 PCB에 직접 장착된 엘이디 패키지와, 와이어와 PCB를 연결하기 위한 단자를 하나의 몰드에 모두 조립하고, 몰드에는 엘이디 칩이 관통되도록 엘이디 관통홀이 형성된다.