APPARATUS FOR MOUNTING COMPONENT

An apparatus for mounting a component includes a mounting head with a plurality of nozzle attaching units which are formed at positions with different horizontal directions and a plurality of absorption nozzles which are attached on the nozzle attaching unit. The absorption nozzle includes a connection part which is connected to the nozzle attaching unit and a component absorption surface which includes a suction hole whose center is located in a misalignment position in the horizontal direction from the center position of the connection part. The adjacent nozzles among the absorption nozzles are attached on the nozzle attaching unit when an interval between the center positions of the suction holes of the absorption nozzles is larger than an interval between the center positions of the connection parts of the absorption nozzles.