TAPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME

TAPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME

A tape package includes a base substrate which includes a signal transmission region and a protruding region which protrudes from the signal transmission region, an IC chip which is mounted on the base substrate, and a lead line which includes a first part which is arranged on the base substrate and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GO, JEONG HUN, KIM, YOUNG SUN, NA, HOE SEOK, SHIN, KI HAE, KU, HEE UN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A tape package includes a base substrate which includes a signal transmission region and a protruding region which protrudes from the signal transmission region, an IC chip which is mounted on the base substrate, and a lead line which includes a first part which is arranged on the base substrate and is electrically connected to the IC chip, a second part which is connected to the first part and is extended in a first direction, and a third part which is connected to the second part and is extended in a second direction intersecting with the first direction.