APPARATUS FOR PROCESSING A WAFER
According to an embodiment, an apparatus for processing a wafer includes: a first plate which is for placing at least one carrier into which the wafer inserted, and has first holes; a first injection unit which is connected to the first holes; a second plate which faces the first plate and has secon...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | According to an embodiment, an apparatus for processing a wafer includes: a first plate which is for placing at least one carrier into which the wafer inserted, and has first holes; a first injection unit which is connected to the first holes; a second plate which faces the first plate and has second holes; a second injection unit which is connected to the second holes; and a first motor and a second motor which drive the first plate and the second plate, respectively.
실시예는 웨이퍼가 삽입된 적어도 하나의 캐리어가 놓여지고, 복수 개의 제1 홀이 형성된 제1 정반; 상기 복수 개의 제1 홀에 연결되는 제1 주입구; 상기 제1 정반과 마주보고 배치되고, 복수 개의 제2 홀이 형성된 제2 정반; 상기 복수 개의 제2 홀에 연결되는 제2 주입구; 및 상기 제1 정반과 제2 정반을 각각 구동시키는 제1 모터와 제2 모터를 포함하는 웨이퍼의 가공 장치를 제공한다. |
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