DEFORMATION MEASURING APPARATUS USING SHEAROGRAPHY
The present invention relates to a deformation measuring apparatus using shearography comprising: a support unit to support an object to be measured; a main light source to irradiate light to the object to be measured supported by the support unit; a beam splitter to split the light which is reflect...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present invention relates to a deformation measuring apparatus using shearography comprising: a support unit to support an object to be measured; a main light source to irradiate light to the object to be measured supported by the support unit; a beam splitter to split the light which is reflected after being irradiated to the object to be measured into a first path and a second path in a direction perpendicular to the first path and to output the light; a basis mirror installed to allow the light to re-enter the beam splitter by reflecting the light coming to the first path from the beam splitter; a variable mirror installed to allow the light to re-enter the beam splitter by reflecting the light coming to the second path from the beam splitter; a tilting unit to tilt the variable mirror with respect to horizontal and vertical directions based on the second path; an imaging unit to image the light re-entering the beam splitter from the basis mirror and the variable mirror and output to a third path; and a processing unit to display an interference fringe through a display unit by receiving the interference fringe imaged by the imaging unit while adjusting the tilting angle of the variable mirror by controlling the tilting unit. The present invention has an effect of increasing defect measurement accuracy by tilting the variable mirror with respect to two shaft directions.
본 발명은 전단간섭법을 이용한 변형측정 장치에 관한 것으로서, 측정대상체를 지지할 수 있도록 지지부와, 지지부에 지지된 측정대상체에 광을 조사하는 메인 광원부와, 측정대상체에 조사된 후 반사된 광을 제1경로와 제1경로와 직교되는 방향인 제2경로로 분할하여 출력하는 빔스플릿터와, 빔스플릿터에서 제1경로로 진행되는 광을 반사시켜 빔스플릿터로 재입사되게 설치된 기준미러와, 빔스플릿터에서 제2경로로 진행되는 광을 반사시켜 빔스플릿터로 재입사되게 설치된 가변미러와, 가변미러를 제2경로를 중심으로 좌우방향 및 상하방향에 대해 틸팅시킬 수 있도록 된 틸팅부와, 기준미러와 가변미러로부터 빔스플릿터에 재입사되어 제3경로로 출력되는 광을 촬상하는 촬상부와, 틸팅부를 제어하여 가변미러의 틸팅각도를 조정하면서 촬상부에 의해 촬상된 간섭무늬를 수신하여 표시부를 통해 표시되게 처리하는 처리유니트를 구비한다. 이러한 전단간섭법을 이용한 변형측정장치에 의하면, 가변미러가 두 축방향에 대해 기울임이 가능하여 결함측정 정밀도를 높일 수 있다. |
---|