LATENT-REACTIVE HOT-MELT ADHESIVE COMPOSITION

본 발명은 a) NCO 기에 대하여 일작용성으로 반응하고 고 인장 강도를 갖는 하나 이상의 제1 열가소성 중합체, b) NCO 기에 대하여 적어도 이작용성으로, 바람직하게는 삼작용성 또는 다작용성으로 반응하고 중합체 a)의 용융 온도 T보다 낮은 용융 온도 T을 보유하며, 그리고 액체 형태로 존재하는, 제1 중합체 a)와 상용성인 하나 이상의 제2 NCO 반응성 중합체 및/또는 올리고머, c) 하나 이상의 고체의, 표면 불활성화된 디이소시아네이트 또는 폴리이소시아네이트, d) 임의로, NCO 기와 반응하지 않은 하나 이상의 추가 열가소성 중합체(들)을 포함하는 잠재 반응성 핫 멜트 접착제 조성물에 관한 것이다. 본 발명에 따른 그러한 조성물은 유의적으로 개선된 기계적 특징을 갖는다. Latent reactive hot melt adhesive composition comprises (a) at least one first thermoplastic polymer, which is monofunctionally reactive against isocyanate groups, (b) at least one second isocyanate-reactive polymer and/or oligomer, which is at least di-, tri- or multifunctionally reactive against isocyanate groups, (c) at least one solid surface-deactivated diisocyanate and/or polyisocyanate, and (d) optionally at least one additional thermoplastic polymer, which does not react with isocyanate groups. The component (a) has a tensile strength of \-4-30 MPa. Latent reactive hot melt adhesive composition comprises (a) at least one first thermoplastic polymer, which is monofunctionally reactive against isocyanate groups, (b) at least one second isocyanate-reactive polymer and/or oligomer, which is at least di-, tri- or multifunctionally reactive against isocyanate groups, (c) at least one solid surface-deactivated diisocyanate and/or polyisocyanate, and (d) optionally at least one additional thermoplastic polymer, which does not react with isocyanate groups. The component (a) has a tensile strength of \-4-30 MPa measured according to ISO 527-1:1996, and a breaking elongation of \- 5% to 1000% measured according to EN ISO 527-1:1996. The component (b) has a melting temperature, which is lower than the melting temperature of the polymer (a), and is present in liquid form at 40 deg C, preferably 20 deg C. Independent claims are also included for: 1) producing the latent reactive hot melt adhesive granule comprising mixing at least one isocyanate with at least one deactivating agent and optionally with the component (b), (ii) mixing the solution obtained in the step (i) with a mixture of component (a) and optionally with the component (b) and/or (d) in a mixing apparatus at a temperature of \-40 deg C to 100 deg C, preferably 50-70 deg C, (iii) extruding the mixture obtained in the step (ii) as a strand, and (iv) granulating the strand; 2) producing the latent reactive hot melt adhesive film comprising mixing at least one isocyanate with at least one deactivating agent and optionally