SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
The present invention relates to a semiconductor device and a method for manufacturing the same. The semiconductor device includes: first semiconductor patterns including protruding parts on sidewalls and second semiconductor patterns connected to the first semiconductor patterns respectively, whose...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention relates to a semiconductor device and a method for manufacturing the same. The semiconductor device includes: first semiconductor patterns including protruding parts on sidewalls and second semiconductor patterns connected to the first semiconductor patterns respectively, whose width increases when growing apart from a contact surface with the first semiconductor patterns.
반도체 장치는 측벽에 돌출부들을 포함하는 제1 반도체 패턴들; 및 상기 제1 반도체 패턴들과 각각 연결되고, 상기 제1 반도체 패턴과의 접합면으로부터 멀어질수록 폭이 증가되는 제2 반도체 패턴들을 포함한다. |
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