WAFER PROCESSING APPARATUS AND CONTROLLING METHOD THEREOF

Disclosed are a wafer processing apparatus and a control method thereof. The wafer processing apparatus according to the present invention includes a chuck table device which loads a wafer, a recovery device which includes a plurality of recovery containers which are arranged to surround the chuck t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PARK, JI HO, LEE, HYUN JAE, KIM, TAE HOON, MO, SUNG WON, JUNG, SEOK JUN, CHOI, MUN SUP, LEE, SEUNG HOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Disclosed are a wafer processing apparatus and a control method thereof. The wafer processing apparatus according to the present invention includes a chuck table device which loads a wafer, a recovery device which includes a plurality of recovery containers which are arranged to surround the chuck table device, and a lifting device which is installed on the recovery containers to individually lift the recovery containers. 웨이퍼 처리 장치 및 그 제어방법에 대한 발명이 개시된다. 본 발명의 웨이퍼 처리 장치는: 웨이퍼가 로딩되는 척테이블 장치; 척테이블 장치를 둘러싸도록 배치되는 복수의 회수통을 포함하는 회수 장치; 및 복수의 회수통을 개별적으로 승강시키도록 복수의 회수통에 설치되는 승강 장치를 포함하는 것을 특징으로 한다.