A SHOWER HEAD APPARATUS

Disclosed is a shower head apparatus. The shower head apparatus comprises: a chamber case which forms a space where a substrate can be processed; a gas supply unit for supplying process gas into the chamber case; a shower head which is arranged on the inside of the chamber case to be able to adjust...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LEE, JAE SOAK, LEE, YONG WOO, PARK, KANG SOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed is a shower head apparatus. The shower head apparatus comprises: a chamber case which forms a space where a substrate can be processed; a gas supply unit for supplying process gas into the chamber case; a shower head which is arranged on the inside of the chamber case to be able to adjust location and receives the process gas from the gas supply unit to spray the process gas on the substrate; and a variable pipe line unit which is arranged to connect the gas supply unit and the shower head for the supply of the process gas and is formed so a connection section can change to the state of an even pipe line atmosphere in response to location adjustment motion of the shower head. 샤워헤드 장치를 개시한다. 이러한 샤워헤드 장치는, 기판이 처리될 수 있는 공간을 형성하는 챔버케이스와, 상기 챔버케이스 측에 공정가스를 공급하기 위한 가스공급부와, 위치 조절이 가능한 상태로 상기 챔버케이스 내측에 배치되며, 상기 가스공급부로부터 공정가스를 공급받아서 상기 기판에 분사하기 위한 샤워헤드 그리고, 상기 가스공급부와 상기 샤워헤드 사이를 공정가스 공급이 가능하게 연결하는 상태로 배치되며, 상기 샤워헤드의 위치 조절 동작과 대응하여 균일한 관로 분위기를 이루는 상태로 연결 구간이 변화될 수 있도록 형성된 가변관로부를 포함한다.