RESIN COMPOSITION FOR LIGHT GUIDE BODY PREFORM, LIGHT GUIDE BODY PREFORM, LAMINATE LIGHT GUIDE BODY PREFORM, LIGHT GUIDE BODY FOR AREA LIGHT SOURCE DEVICE, AND AREA LIGHT SOURCE DEVICE

A resin composition for a light guide article-preform is described, which enables the formation of a foamed layer having a large light scattering effect on the surface of a shaped article by laser irradiation processing at low cost. More specifically, the present invention relates to: a resin compos...

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Bibliographische Detailangaben
Hauptverfasser:	YAGI KENJI, SAIKI SHINJI, SECHI YOUHEI, ONUMA FUMIKO, SHIMIZU MINORU, KURACHI YOSHIYA, YAMASHITA TOMOYOSHI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BLASTING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A resin composition for a light guide article-preform is described, which enables the formation of a foamed layer having a large light scattering effect on the surface of a shaped article by laser irradiation processing at low cost. More specifically, the present invention relates to: a resin composition for a light guide article-preform, which contains a resin having a mass average molecular weight of 60,000 to 150,000, and has a 30% thermal mass reduction temperature of 310° C. or lower and a difference between a 40% thermal mass reduction temperature and a 20% thermal mass reduction temperature of 7° C. or less when a thermal mass measurement is performed with starting from the state at 100° C. under air at a temperature rising rate of 5° C./min.