flexible device using packaging technology

The present invention relates to a flexible device using a packaging technology. Provided is a flexible device including: a flexible substrate; a plurality of electrode lines provided on the flexible substrate; an anisotropic conductive film laminated on the flexible substrate and making contact wit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BAEK, KYUNG WOOK, HWANG, GEON TAE, YU, HYEON KYUN, KIM, YOO SUN, KIM, DO HYUN, LEE, KEON JAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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