flexible device using packaging technology

The present invention relates to a flexible device using a packaging technology. Provided is a flexible device including: a flexible substrate; a plurality of electrode lines provided on the flexible substrate; an anisotropic conductive film laminated on the flexible substrate and making contact with the electrode line; a plurality of bumps provided on the anisotropic conductive film; and a circuit board having an electronic device provided at one side thereof and making contact with the bumps. The anisotropic conductive film and the circuit board are connected to the bump, which is a conductive member used for circuit packaging, and the electrode line, and the electrode line makes contact with the anisotropic conductive film and then extends outside the anisotropic conductive film.