TARGET MODULE OF A FACING SPUTTERING APPARATUS, FACING SPUTTERING APPARATUS, AND METHOD OF DEPOSITING A THIN FILM USING THE SAME

A target module of an opposed sputtering apparatus includes: a target; a target electrode supporting the target; a case surrounding the target and the target electrode and having an opening which exposes one surface of the target; an insulation part positioned between the target electrode and the ca...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM, OU HYEN, KANG, SEOK WOO, YU, SEUNG GYU, LEE, UNG SOO, KIM, HUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A target module of an opposed sputtering apparatus includes: a target; a target electrode supporting the target; a case surrounding the target and the target electrode and having an opening which exposes one surface of the target; an insulation part positioned between the target electrode and the case and covering the outer surface of the target electrode; and a magnetic field generation part arranged in the lower portion of the target electrode.