COPPER ALLOY SPUTTERING TARGET

The present invention relates to a copper alloy sputtering target. The present invention has a copper alloy having 0.3-1.7 mass% of Ca, and the remaining comprised of Cu and inevitable impurities. Ca segregation phases (10) having Ca which is segregated in a parent phase are distributed, and the Ca...

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Bibliographische Detailangaben
Hauptverfasser:	MORI SATORU, OOKUBO KIYOYUKI, SAKAMOTO TOSHIO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	The present invention relates to a copper alloy sputtering target. The present invention has a copper alloy having 0.3-1.7 mass% of Ca, and the remaining comprised of Cu and inevitable impurities. Ca segregation phases (10) having Ca which is segregated in a parent phase are distributed, and the Ca segregation phases have Cu distribution phases (11) comprised of Cu.