MASK FOR EXTREME ULTRAVIOLET LITHOGRAPHY PROCESS
Provided is a mask for an extreme ultraviolet lithography process. The mask includes a reflection layer which includes a first material layer and a second material layer which are repeatedly and alternately stacked on a substrate and a second material layer, a phase modulation pattern which is arran...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Provided is a mask for an extreme ultraviolet lithography process. The mask includes a reflection layer which includes a first material layer and a second material layer which are repeatedly and alternately stacked on a substrate and a second material layer, a phase modulation pattern which is arranged on the reflection layer, and an absorption layer which is arranged on the phase modulation pattern and includes a platinum group compound. |
---|