METHOD FOR PEELING OF PROTECTING FILM

The present invention relates to a method for peeling off a protective film and, more specifically, to a method for peeling off a protective film on a remaining portion except at least two cut regions of a window substrate having one surface bonded with the protective film, and the inside with the at least two cut regions. The method comprises the steps of: cutting the bonded protective film such that the shortest distance from any two adjacent edges of the protective film to regions corresponding to a plurality of cut parts of the window substrate is greater than a gap between regions corresponding to the cut parts; and peeling off the protective film from one end of the edge to the other end thereof. Therefore, the method may control breakage of a protective film which may occur in the peeling process and may peel off the protective film only with a one-time peeling process to shorten process time, thereby improving process efficiency.