SEMICONDUCTOR CHIP AND STACKED TYPE SEMICONDUCTOR PACKAGE HAVING THE SAME

The present technology provides a semiconductor chip and a stack type semiconductor package including the same, capable of easily discharging heat. The semiconductor chip according to the present technology includes: a semiconductor chip body which includes a first surface on which a plurality of bo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOI, WOONG KYU, CHUN, KUK JIN, LEE, BYOUNG DO, KIM, JONG HOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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