SEMICONDUCTOR CHIP AND STACKED TYPE SEMICONDUCTOR PACKAGE HAVING THE SAME
The present technology provides a semiconductor chip and a stack type semiconductor package including the same, capable of easily discharging heat. The semiconductor chip according to the present technology includes: a semiconductor chip body which includes a first surface on which a plurality of bo...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present technology provides a semiconductor chip and a stack type semiconductor package including the same, capable of easily discharging heat. The semiconductor chip according to the present technology includes: a semiconductor chip body which includes a first surface on which a plurality of bonding pads are formed and a second surface which faces the first surface; a plurality of first and second through electrodes which pass through the semiconductor chip body and are electrically connected to the bonding pad through one side thereof; an insulation layer which is formed on the second surface of the semiconductor chip body to expose the other sides of the first and second through electrodes; and a first heat distribution layer which is formed on the insulation layer. |
---|