SEMICONDUCTOR CHIP AND STACKED TYPE SEMICONDUCTOR PACKAGE HAVING THE SAME

The present technology provides a semiconductor chip and a stack type semiconductor package including the same, capable of easily discharging heat. The semiconductor chip according to the present technology includes: a semiconductor chip body which includes a first surface on which a plurality of bo...

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Bibliographische Detailangaben
Hauptverfasser: CHOI, WOONG KYU, CHUN, KUK JIN, LEE, BYOUNG DO, KIM, JONG HOON
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present technology provides a semiconductor chip and a stack type semiconductor package including the same, capable of easily discharging heat. The semiconductor chip according to the present technology includes: a semiconductor chip body which includes a first surface on which a plurality of bonding pads are formed and a second surface which faces the first surface; a plurality of first and second through electrodes which pass through the semiconductor chip body and are electrically connected to the bonding pad through one side thereof; an insulation layer which is formed on the second surface of the semiconductor chip body to expose the other sides of the first and second through electrodes; and a first heat distribution layer which is formed on the insulation layer.