SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FABRICATING THE SAME

The present invention relates to a semiconductor package including a through electrode and a manufacturing method thereof, capable of improving productivity. The method for manufacturing the semiconductor package including the through electrode according to the present invention includes the steps o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHUNG, HYUN SOO, JO, CHA JEA, CHO, MOON GI, MA, KEUM HEE, CHO, TAE JE, LEE, IN YOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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