SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FABRICATING THE SAME

The present invention relates to a semiconductor package including a through electrode and a manufacturing method thereof, capable of improving productivity. The method for manufacturing the semiconductor package including the through electrode according to the present invention includes the steps of: providing a first substrate which includes a first circuit layer; forming a front mold layer on the front side of the first substrate; polishing the rear of the first substrate; forming a first through electrode which is electrically connected to the first through electrode by passing through the first substrate; providing a second substrate which includes a second circuit layer which is electrically connected to the first through electrode on the rear of the first substrate; forming a rear mold layer to mold the second substrate on the rear side of the first substrate; and removing the front mold layer.