GRINDING CLEANING SHEET OF SEMICONDUCTOR PROBEROD

The present invention relates to a sheet grinding and cleaning an end of a probe rod utilized for testing a wafer of a semiconductor. The purpose of the present invention is to enhance capacities for grinding and cleaning the probe rod by forming a grinding layer and a cleaning layer separately and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: YOUN, KYUNG SEOB
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YOUN, KYUNG SEOB
description The present invention relates to a sheet grinding and cleaning an end of a probe rod utilized for testing a wafer of a semiconductor. The purpose of the present invention is to enhance capacities for grinding and cleaning the probe rod by forming a grinding layer and a cleaning layer separately and to provide the grinding and cleaning sheet of the probe rod of the semiconductor preventing the end of the probe rod from being stained with insulating oil from an adhesive material of the cleaning layer when cleaning the probe rod. The grinding and cleaning sheet proposed by the present invention includes the grinding layer (20) with the improved distribution of a grinding power and the cleaning layer (40) formed of the adhesion on the grinding layer. The present invention is characterized in that the cleaning layer (40) is completed by mixing liquid silicon and diluted and evaporated materials and then drying the mixed materials at high temperatures.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20140136635A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20140136635A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20140136635A3</originalsourceid><addsrcrecordid>eNrjZDB0D_L0c_H0c1dw9nF19AMxgj1cXUMU_N0Ugl19PZ39_VxCnUP8gxQCgvydXIP8XXgYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSbx3kJGBoYmBobGZmbGpozFxqgDr5Sdv</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>GRINDING CLEANING SHEET OF SEMICONDUCTOR PROBEROD</title><source>esp@cenet</source><creator>YOUN, KYUNG SEOB</creator><creatorcontrib>YOUN, KYUNG SEOB</creatorcontrib><description>The present invention relates to a sheet grinding and cleaning an end of a probe rod utilized for testing a wafer of a semiconductor. The purpose of the present invention is to enhance capacities for grinding and cleaning the probe rod by forming a grinding layer and a cleaning layer separately and to provide the grinding and cleaning sheet of the probe rod of the semiconductor preventing the end of the probe rod from being stained with insulating oil from an adhesive material of the cleaning layer when cleaning the probe rod. The grinding and cleaning sheet proposed by the present invention includes the grinding layer (20) with the improved distribution of a grinding power and the cleaning layer (40) formed of the adhesion on the grinding layer. The present invention is characterized in that the cleaning layer (40) is completed by mixing liquid silicon and diluted and evaporated materials and then drying the mixed materials at high temperatures.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GRINDING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20141201&amp;DB=EPODOC&amp;CC=KR&amp;NR=20140136635A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20141201&amp;DB=EPODOC&amp;CC=KR&amp;NR=20140136635A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOUN, KYUNG SEOB</creatorcontrib><title>GRINDING CLEANING SHEET OF SEMICONDUCTOR PROBEROD</title><description>The present invention relates to a sheet grinding and cleaning an end of a probe rod utilized for testing a wafer of a semiconductor. The purpose of the present invention is to enhance capacities for grinding and cleaning the probe rod by forming a grinding layer and a cleaning layer separately and to provide the grinding and cleaning sheet of the probe rod of the semiconductor preventing the end of the probe rod from being stained with insulating oil from an adhesive material of the cleaning layer when cleaning the probe rod. The grinding and cleaning sheet proposed by the present invention includes the grinding layer (20) with the improved distribution of a grinding power and the cleaning layer (40) formed of the adhesion on the grinding layer. The present invention is characterized in that the cleaning layer (40) is completed by mixing liquid silicon and diluted and evaporated materials and then drying the mixed materials at high temperatures.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GRINDING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB0D_L0c_H0c1dw9nF19AMxgj1cXUMU_N0Ugl19PZ39_VxCnUP8gxQCgvydXIP8XXgYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSbx3kJGBoYmBobGZmbGpozFxqgDr5Sdv</recordid><startdate>20141201</startdate><enddate>20141201</enddate><creator>YOUN, KYUNG SEOB</creator><scope>EVB</scope></search><sort><creationdate>20141201</creationdate><title>GRINDING CLEANING SHEET OF SEMICONDUCTOR PROBEROD</title><author>YOUN, KYUNG SEOB</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20140136635A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GRINDING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YOUN, KYUNG SEOB</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOUN, KYUNG SEOB</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GRINDING CLEANING SHEET OF SEMICONDUCTOR PROBEROD</title><date>2014-12-01</date><risdate>2014</risdate><abstract>The present invention relates to a sheet grinding and cleaning an end of a probe rod utilized for testing a wafer of a semiconductor. The purpose of the present invention is to enhance capacities for grinding and cleaning the probe rod by forming a grinding layer and a cleaning layer separately and to provide the grinding and cleaning sheet of the probe rod of the semiconductor preventing the end of the probe rod from being stained with insulating oil from an adhesive material of the cleaning layer when cleaning the probe rod. The grinding and cleaning sheet proposed by the present invention includes the grinding layer (20) with the improved distribution of a grinding power and the cleaning layer (40) formed of the adhesion on the grinding layer. The present invention is characterized in that the cleaning layer (40) is completed by mixing liquid silicon and diluted and evaporated materials and then drying the mixed materials at high temperatures.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; kor
recordid cdi_epo_espacenet_KR20140136635A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GRINDING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
title GRINDING CLEANING SHEET OF SEMICONDUCTOR PROBEROD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T06%3A41%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOUN,%20KYUNG%20SEOB&rft.date=2014-12-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20140136635A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true