GRINDING CLEANING SHEET OF SEMICONDUCTOR PROBEROD

The present invention relates to a sheet grinding and cleaning an end of a probe rod utilized for testing a wafer of a semiconductor. The purpose of the present invention is to enhance capacities for grinding and cleaning the probe rod by forming a grinding layer and a cleaning layer separately and to provide the grinding and cleaning sheet of the probe rod of the semiconductor preventing the end of the probe rod from being stained with insulating oil from an adhesive material of the cleaning layer when cleaning the probe rod. The grinding and cleaning sheet proposed by the present invention includes the grinding layer (20) with the improved distribution of a grinding power and the cleaning layer (40) formed of the adhesion on the grinding layer. The present invention is characterized in that the cleaning layer (40) is completed by mixing liquid silicon and diluted and evaporated materials and then drying the mixed materials at high temperatures.