GAS SPRAYER AND THIN FILM DEPOSITING APPARATUS HAVING THE SAME

Disclosed are a gas injector capable of reducing the process time and forming a uniform thin film, and a thin film depositing apparatus having the same The gas injector comprises an upper plate and a lower plate. The upper plate includes multiple first gas inlets. The lower plate, which is combined...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHOI, WOO JIN, JANG, SEUNG HYUN, HWANG, BYEONG EOK, KIM, KYUNG HAN, KIM, JONG HAK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed are a gas injector capable of reducing the process time and forming a uniform thin film, and a thin film depositing apparatus having the same The gas injector comprises an upper plate and a lower plate. The upper plate includes multiple first gas inlets. The lower plate, which is combined with the upper plate and fors a diffusion space therein, and includes multiple first gas injection holes for spraying the gas which exists in the diffusion space by being injected through the multiple first gas inlets. Moreover, the first gas inlets can be arranged symmetrically with each other.