PCB SUBSTRATE FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING PCB SUBSTRATE AND LIGHT EMITTING DEVICE PACKAGE ASSEMBLY

PCB SUBSTRATE FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING PCB SUBSTRATE AND LIGHT EMITTING DEVICE PACKAGE ASSEMBLY

Provided is a printed circuit board for a light emitting device package according to one embodiment of the present invention. The printed circuit board for the light emitting device package includes a connection pad in contact with the light emitting device package on a base substrate. The printed c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM, YANG JOONG, JEONG, BI YONG
Format: Patent
Sprache:eng ; kor
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Provided is a printed circuit board for a light emitting device package according to one embodiment of the present invention. The printed circuit board for the light emitting device package includes a connection pad in contact with the light emitting device package on a base substrate. The printed circuit board for the light emitting device package includes a recess pattern on a part of the connection pad and an alignment pattern which functions as an alignment between the base substrate and the light emitting device package.