SEMICONDUCTOR POWER MODULE PACKAGE WITH SIMPLIFIED STRUCTURE AND METHOD OF FABRICATING THE SAME

Disclosed are a semiconductor power module package of which a structure is simplified by attaching an electrode on a substrate, and a method for manufacturing the same. The semiconductor power module package comprises: a substrate; semiconductor chips arranged on the upper surface of the substrate; and electrodes which are attached to the upper surface of the substrate and are electrically connected to the semiconductor chips. Some semiconductor chips among the semiconductor chips and some electrodes among the electrodes are electrically connected through a wiring line. An encapsulation portion covers the semiconductor chips, the electrodes, and the wiring lines except the upper surface of the electrodes.