CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

A chip-on film package comprises a ductile base film having a first surface and a second surface which face each other and forming at least one penetration hole. A plurality of wires are respectively formed on the first surface and the second surface of the base film and have a first lead and a seco...

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Bibliographische Detailangaben
Hauptverfasser:	SHIN,RAE, LIM, SO YOUNG, LEE, KWAN JAI, LEE, PA LAN, CHO, KYONG SOON, JUNG, JAE MIN, HA, JEONG KYU, YANG, KYOUNG SUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A chip-on film package comprises a ductile base film having a first surface and a second surface which face each other and forming at least one penetration hole. A plurality of wires are respectively formed on the first surface and the second surface of the base film and have a first lead and a second lead which are connected to each other through the penetration hole. Each operating chip for a display panel and sensor chip for a touch panel is mounted on either the first surface or the second surface of the base film, and either the driving chip for the display panel or the sensor chip for the touch panel is electrically connected with the first and second lead.