POLYVINYLBUTYRAL RESIN, MULTILAYER CHIP CAPACITOR USING THE SAME
The present invention relates to a multilayer chip capacitor comprising: polyvinylbutyral resin having linkage group A and including curable functional group B at an end thereof; and a green sheet cured using the same. According to an embodiment of the present invention, the polyvinylbutyral binder...
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| creator | CHO, HANG KYU CHOI, JAE YEOL KANG, SIM CHUNG MOON, JE IK SHIN, JIN BOK |
| description | The present invention relates to a multilayer chip capacitor comprising: polyvinylbutyral resin having linkage group A and including curable functional group B at an end thereof; and a green sheet cured using the same. According to an embodiment of the present invention, the polyvinylbutyral binder resin including the linkage group and the curable functional group is used for a dielectric layer and an inner electrode layer to have excellent membrane strength by being cured. Also, damage to a membrane due to an organic solvent can be prevented and the membrane can be stacked easily as the membrane has an excellent exfoliation property from a base film owing to the contraction of the binder resin during curing. |
| format | Patent |
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According to an embodiment of the present invention, the polyvinylbutyral binder resin including the linkage group and the curable functional group is used for a dielectric layer and an inner electrode layer to have excellent membrane strength by being cured. 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According to an embodiment of the present invention, the polyvinylbutyral binder resin including the linkage group and the curable functional group is used for a dielectric layer and an inner electrode layer to have excellent membrane strength by being cured. Also, damage to a membrane due to an organic solvent can be prevented and the membrane can be stacked easily as the membrane has an excellent exfoliation property from a base film owing to the contraction of the binder resin during curing.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | POLYVINYLBUTYRAL RESIN, MULTILAYER CHIP CAPACITOR USING THE SAME |
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