POLYVINYLBUTYRAL RESIN, MULTILAYER CHIP CAPACITOR USING THE SAME

The present invention relates to a multilayer chip capacitor comprising: polyvinylbutyral resin having linkage group A and including curable functional group B at an end thereof; and a green sheet cured using the same. According to an embodiment of the present invention, the polyvinylbutyral binder...

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Bibliographische Detailangaben
Hauptverfasser:	CHO, HANG KYU, CHOI, JAE YEOL, KANG, SIM CHUNG, MOON, JE IK, SHIN, JIN BOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a multilayer chip capacitor comprising: polyvinylbutyral resin having linkage group A and including curable functional group B at an end thereof; and a green sheet cured using the same. According to an embodiment of the present invention, the polyvinylbutyral binder resin including the linkage group and the curable functional group is used for a dielectric layer and an inner electrode layer to have excellent membrane strength by being cured. Also, damage to a membrane due to an organic solvent can be prevented and the membrane can be stacked easily as the membrane has an excellent exfoliation property from a base film owing to the contraction of the binder resin during curing.