SYSTEM AND METHOD FOR MEASURING THICKNESS

The present invention relates to a system and a method for thickness measurement and, more particularly, to a system and a method for thickness measurement with which the thickness of a measurement target panel, which is used to determine the surface uniformity of the measurement target panel, can b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, BYOUNG MIN, SHIM, SE KYU
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention relates to a system and a method for thickness measurement and, more particularly, to a system and a method for thickness measurement with which the thickness of a measurement target panel, which is used to determine the surface uniformity of the measurement target panel, can be measured with accuracy. According to the present invention, the measurement target panel is irradiated with a laser light having a plurality of frequency bands such as an SLD, a frequency component is detected from interference patterns of the light respectively reflected from the upper and lower surfaces of the measurement target panel, and the thickness can be measured from the frequency component with precision of several nanometers (nm). Accordingly, system configuration costs can be significantly reduced, and the precision and reliability of thickness measurement can be significantly improved because incident angle adjustment and complicated position adjustment for thickness measurement as in the related art are not required.