MODULE SUBSTRATE AND MODULE

MODULE SUBSTRATE AND MODULE

A module with multiple duplexers provides both miniaturzation and cost reduction. Disclosed are a module substrate (100) which is characterized by including a multilayered wiring substrate (30) including multiple wiring layers (32a-32i), and multiple duplexers (20) embedded in the multilayered wirin...

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Hauptverfasser: TASAKA NAOYUKI, TAKEZAKI TOORU, SASAKI KEN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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creator TASAKA NAOYUKI
TAKEZAKI TOORU
SASAKI KEN
description A module with multiple duplexers provides both miniaturzation and cost reduction. Disclosed are a module substrate (100) which is characterized by including a multilayered wiring substrate (30) including multiple wiring layers (32a-32i), and multiple duplexers (20) embedded in the multilayered wiring substrate (30) to be electrically connected with the wiring layers (32), wherein the multiple embedded duplexers (20) include two duplexers corresponding to at least two bands among band 1, band 2, band 5, and band 8, and a module including the module substrate (100).
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language eng ; kor
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subjects BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
title MODULE SUBSTRATE AND MODULE
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