MODULE SUBSTRATE AND MODULE

MODULE SUBSTRATE AND MODULE

A module with multiple duplexers provides both miniaturzation and cost reduction. Disclosed are a module substrate (100) which is characterized by including a multilayered wiring substrate (30) including multiple wiring layers (32a-32i), and multiple duplexers (20) embedded in the multilayered wirin...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TASAKA NAOYUKI, TAKEZAKI TOORU, SASAKI KEN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Beschreibung
Zusammenfassung:A module with multiple duplexers provides both miniaturzation and cost reduction. Disclosed are a module substrate (100) which is characterized by including a multilayered wiring substrate (30) including multiple wiring layers (32a-32i), and multiple duplexers (20) embedded in the multilayered wiring substrate (30) to be electrically connected with the wiring layers (32), wherein the multiple embedded duplexers (20) include two duplexers corresponding to at least two bands among band 1, band 2, band 5, and band 8, and a module including the module substrate (100).